Pentron Bond-1 Primer/Adhesive Refill, 6 ml, 5th Generation Total-Etch Bonding System, N01lAB
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm. This 6 ml refill is designed for use with the Bond-1 system.
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Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm. This 6 ml refill is designed for use with the Bond-1 system.
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