Bond-1 Activator Refill, 3 ml, N01lAC
Bond-1 is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This activator refill is designed for use with the Bond-1 system, ensuring a reliable bond for all bonding procedures. The system creates an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm.
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Bond-1 is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This activator refill is designed for use with the Bond-1 system, ensuring a reliable bond for all bonding procedures. The system creates an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm.
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