Bond-1 Primer/Adhesive Refill, Activator, 3 ml, N01lAC
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8 µm. This refill contains the activator component in a 3 ml bottle.
Vendor Pricing Comparison
Sorted by lowest price · Add now, sign in at checkout
Vendor Pricing Comparison
Sorted by lowest price · Add now, sign in at checkout
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8 µm. This refill contains the activator component in a 3 ml bottle.
1 vendor
