Bond-1 Primer/Adhesive, 5th Generation Total-Etch Bonding System, 37% Etch Gel, 5 ml Syringe, 2/Box, N01lB
Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm. The kit includes a 5 ml syringe of the primer/adhesive and a 37% etch gel, packaged as 2 per box.
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Bond-1 Primer/Adhesive is a 5th generation total-etch bonding system that provides high bond strengths in a convenient single bottle application. This versatile system can be used for all bonding procedures, creating an ideal sealed surface and interpenetrated network of polymerized primers and unfilled resin, resulting in a high bond with a low film thickness of only 8µm. The kit includes a 5 ml syringe of the primer/adhesive and a 37% etch gel, packaged as 2 per box.
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