
Bond-1 Dual Cure Activator is a 5th generation total-etch bonding system component designed for use with the Bond-1 Primer/Adhesive system. This dual-cure activator enables compatibility with both self- and dual-cure resin materials, providing high bond strength to dentin and enamel with a low film thickness of only 8μm. The system offers a simple, time-saving application technique for both direct and indirect restorations, bonding to various surfaces including light or chemical-cured composites, porcelains, metal restorations, and amalgam.
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Sorted by lowest price · Add now, sign in at checkout










Bond-1 Dual Cure Activator is a 5th generation total-etch bonding system component designed for use with the Bond-1 Primer/Adhesive system. This dual-cure activator enables compatibility with both self- and dual-cure resin materials, providing high bond strength to dentin and enamel with a low film thickness of only 8μm. The system offers a simple, time-saving application technique for both direct and indirect restorations, bonding to various surfaces including light or chemical-cured composites, porcelains, metal restorations, and amalgam.
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