Tokuyama Bond Force Self-Etching Light-Cured Dental Adhesive, Unit Dose Kit, 0.1 ml, 20/Box, 14912
Bond Force is a seventh generation, single-component, light-cured, self-etching dental adhesive that requires only one application to achieve high bond strength. Its self-leveling technology ensures a uniform adhesive layer with a film thickness as thin as 8 µm. Designed for use on both cut and uncut enamel and dentin, this unit dose kit provides 20 individually sealed 0.1 ml doses for convenient, hygienic application.
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Bond Force is a seventh generation, single-component, light-cured, self-etching dental adhesive that requires only one application to achieve high bond strength. Its self-leveling technology ensures a uniform adhesive layer with a film thickness as thin as 8 µm. Designed for use on both cut and uncut enamel and dentin, this unit dose kit provides 20 individually sealed 0.1 ml doses for convenient, hygienic application.
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