
Bond Force is a seventh generation single component light-cured, self-etching dental adhesive that requires one application to achieve award winning bond strength. The self-leveling technology allows for a uniform adhesive layer that has a film thickness as thin as 8µm. Bond Force is designed to be used on both cut/uncut enamel and dentin.
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Sorted by lowest price · Add now, sign in at checkout

Bond Force is a seventh generation single component light-cured, self-etching dental adhesive that requires one application to achieve award winning bond strength. The self-leveling technology allows for a uniform adhesive layer that has a film thickness as thin as 8µm. Bond Force is designed to be used on both cut/uncut enamel and dentin.
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