Bond-1 Bonding System, Total-Etch, Solvent-Free Adhesive Syringe Kit, 1 ml, 2/Pk, N03N

Product Description

Bond-1 SF combines an outstanding degree of adhesion with easy application. Using a unique formulation, Bond-1 provides both direct and indirect restorations with an unparalleled bond strength of up to 30. 4 MPa with no air drying required. This process creates a stable and consistent bond and reduces sensitivity for patients. Each Kit contains 2 (1 ml) syringes, flocked needle tips, and instructions.

Product Details