Bond-1 Bonding System, Total-Etch, Primer/Adhesive Refill, 4 ml, 1/Pk, N01IAA

Product Description

The Primer/Adhesive refill for the Bond-1 Bonding System combines outstanding 5th generation adhesion with an easy application for all bonding procedures. Using a unique formulation, Bond-1 provides direct and indirect restorations with an unparalleled bond strength of up to 31 MPa with only an 8-micrometer layer of adhesive, with no priming required. The low film thickness contributes to the durable bonding between the surface and the restorative materials. This one-step system eliminates post-operative sensitivity for a better patient experience.

Product Details