
These wafer thin separating discs from Dedeco are designed for precision cutting and finishing of porcelain, gold, composite, enamel, and crown & bridge metals. The ultra-thin profile (0.015") provides maximum control and accuracy for intricate lab work. Each box contains 100 discs, ideal for use with die grinders and rotary tools.
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Sorted by lowest price · Add now, sign in at checkout




These wafer thin separating discs from Dedeco are designed for precision cutting and finishing of porcelain, gold, composite, enamel, and crown & bridge metals. The ultra-thin profile (0.015") provides maximum control and accuracy for intricate lab work. Each box contains 100 discs, ideal for use with die grinders and rotary tools.
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